For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...
Abstract: The harsh electromagnetic environment poses a threat to the reliability and safe operation of Gallium nitride (GaN) radio frequency and microwave high-electron-mobility transistors (HEMTs).
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