What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Wistron ITS (WITS), a subsidiary of the Wistron Group, has officially launched a new Semiconductor Business Unit, marking its strategic shift from traditional IT services toward integrated circuit (IC ...

Taiwan's Industrial Development Administration said it has approved 28 projects under its 2025 IC design subsidy program, selecting 33 companies for a combined NT$1.3 billion in government funding.