TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...
TAIPEI (Taiwan News) — Cheng Mei Materials Technology Chair Sung Yen-i (宋妍儀) said the company is undergoing a transformation ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...
Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...
Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...
Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...
ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...
The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...
Advanced packaging is a relatively new innovation in semiconductor fabrication, in which multiple devices (or dies) are bonded together before being encapsulated. It has become essential in enabling ...
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