As technology nodes shrink to 90 nanometers and below, chips become much more difficult to manufacture. In-die process variations increase substantially at 90 nm — even more at 65 nm. If these effects ...

Venice, Florida &@8212 Solido Design Automation has introduced a scalable and extensible solution for meeting design challenges created by process variations at nanometer feature sizes. The new ...

The effect of low-k spacer thickness variation to select the best combination of spacer thickness and S/D epi shape to improve speed and power performance. In this paper, we explore an end-to-end ...

Accurate static timing analysis is one of the most important steps in the development of advanced node semiconductor devices. Performance numbers are included in chip and system specifications from ...

With semiconductor feature sizes continuing to shrink, the variability arising from process technologies such as strained silicon, as well as the manufacturing processes themselves at 45 nm and below, ...