Photon Design has announced that its FIMMWAVE photonic simulation software played a key role in enabling Photonect's development of an epoxy-free, fibre-to-chip optical interconnect technology ...

The Turbo Package Analyzer TPA v5 IC packaging tool features a new automation, design flow, and simulation capability needed to extract the electrical characteristics of complex high-performance BGA ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...