TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Samsung has reportedly hired a veteran semiconductor engineer who worked for its foundry arch-rival TSMC for almost two decades. Lin Jun-cheng will serve the Korean firm as the senior vice president ...

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ --On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming ...

Newer technologies such as 3D chips and heterogeneous packaging is pushing the focus towards materials engineering, Prabu Raja, president, of the Semiconductor Products Group at Applied Materials told ...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

Dublin, Jan. 27, 2026 (GLOBE NEWSWIRE) -- The "3D Semiconductor Packaging Market Report 2026" has been added to ResearchAndMarkets.com's offering. This report provides a thorough insight into the ...

The CSIS American Innovation Project Blog brings together key perspectives on the geopolitical and technological challenges of the twenty-first century. Semiconductor Packaging is an extremely ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...