The TECNO will showcase its modular smartphone concept at Mobile World Congress 2026. The company's "Modular Magnetic Interconnection Technology" aims to ...
TECNO is getting ready to showcase an ultra-thin modular smartphone at MWC 2026 that measures only 4.9mm and comes with slim attachments.
While components in most desktop computers can be easily — well, relatively easily — replaced, laptops tend to be far more difficult to upgrade or replace. Intel is pushing a modular concept that ...
The post TECNO Resurrects Modular Devices with a 4.9mm Concept Smartphone appeared first on Android Headlines.
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