Broadcom Inc. today debuted a new chip, the Sian2, for powering the high-speed optical networks that underpin artificial intelligence clusters. The company says that the module provides twice the ...
At the Optical Fiber Conference (OFC) in Anaheim, Calif., Broadcom Corp. today demonstrated what it claims is the industry’s most integrated dense wave division multiplexing (DWDM) transport ...
Broadcom Inc. today debuted two new chips, the Sian3 and Sian2M, that data center operators can use to power their optical networks. Optical networks are often used to link together the servers in ...
400G and 800G DSP PHYs with integrated TIA and high-swing laser driver deliver best-in-class module performance in BER and power consumption Enables industry’s lowest power 400G and 800G pluggable ...
Semtech and Broadcom Demonstrate Industry’s First 200G/lane Electrical-to-Optical Link at OFC 2023
CAMARILLO, Calif.--(BUSINESS WIRE)--Semtech Corporation (Nasdaq: SMTC), a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced the successful ...
PALO ALTO, Calif., March 31, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These ...
PALO ALTO, Calif., March 13, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (AVGO), the world’s leading provider of fiber optic components for optical networking and communications, today announced several ...
PALO ALTO, Calif., Oct. 01, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global leader in semiconductor and infrastructure software solutions, today announced a significant milestone in ...
Broadcom Inc. announced the availability of the Sian2 200 Gbits/s per lane (200G/lane) PAM-4 DSP PHY. The Sian2 features 200G/lane electrical and optical interfaces, joining the Sian DSP that supports ...
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