Dedicated entirely to flash memory design and application, the first annual Flash Memory Summit, held in San Jose, CA, from August 8 to 10,* will provide attendees with practical information on the ...

Why many commonly held beliefs about 3D flash memory are inaccurate. Details about some of the challenges that 3D flash memory faces as it continues to evolve. Insights into how adding layers affects ...

SanDisk has set up a design center in Bangalore, India, that will do core design work for its flash memory products, the company announced Tuesday. The center currently employs 10 engineers and will ...

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...

QLC UFS offers a higher bit density than traditional TLC UFS, making it suitable for mobile applications that require higher storage capacities. Advancements in ...

Octal flash memory, or octal data transfer interface, utilizes eight data lines for input and output operations, resulting in significantly higher data transfer rates compared to serial, dual, and ...

Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on ...

Advanced Micro Devices Inc. (AMD) plans to develop flash memory chips that blend the best characteristics of the two dominant flash memory architectures, the company announced. AMD’s Ornand chips are ...

Apple has now confirmed reports that it purchased Israeli flash design firm Anobit, but did <em>not</em> comment on the purchase price. An impressive acquisition, not ...

Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage(1) (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, ...