Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work was performed in a collaborative effort between Portland State ...
Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...
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Why board-level insulators and dielectric materials are critical for safe, high-voltage PCB design
Mastering board-level insulation principles like clearance, creepage, and dielectric strength is key to preventing arcing and ensuring long-term dependability.
High-reliability rad hard MOSFETs undergo extensive screening and quality conformance testing to ensure that devices perform to specification in the harshest environments. For Defense Logistics Agency ...
Nexperia’s CFP15B clip-bond surface-mount power package has passed automotive board-level reliability (BLR) testing by a “leading”, said the company, tier-1 supplier. Initially, it will be used in an ...
Reliability allocation methods play a pivotal role in engineering, serving as the means by which system-level reliability requirements are systematically distributed among individual subsystems and ...
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