Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.