Frenchtown, N.J. – Aries Electronics has begun marketing a side-stackable ball grid array socket. The Pin-Ball Socket can be soldered side-by-side, directly to the existing footprint of a ...

Upgrading CPUs in office computers makes a great deal of sense given that while CPU technology has advanced greatly, other components live longer lives before they become obsolete. Upgrading poses a ...

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...

Serving the role of connecting a device and its tester, test sockets—also known as package probes—play a crucial interconnect role in integrated circuits (IC), and therefore the greater field of ...