Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

ASML (NASDAQ:ASML) reigns supreme in the semiconductor equipment world, holding a virtual monopoly on extreme ultraviolet (EUV) lithography machines essential for crafting the most advanced chips.

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...